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Home / Syllabus / B.E. (Biomedical Engineering) / Fourth Year Biomedical Rev 2019 C Scheme / Semester 8 / Biomedical Microsystems Abbreviated As BM

B.E. (Biomedical Engineering) Biomedical Microsystems Abbreviated As BM Syllabus - Mumbai University 2026

This is the Fourth Year Biomedical Rev 2019 C Scheme syllabus under REV-2019 'C' Scheme, in force from the academic year 2022-23. The University has not yet published an NEP 2020 syllabus above Semester IV for this branch, and this is the scheme its examinations are set on.

Biomedical-Microsystems-Abbreviated-as-BM.pdf
Semester 8 · Fourth Year Biomedical Rev 2019 C Scheme

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Syllabus for Biomedical Microsystems (Abbreviated as BM)

Semester 8 · Fourth Year Biomedical Rev 2019 C Scheme

Module 1: Introduction to miniaturization:

  • Difference between Microelectronics and MEMs, Block diagram of MEMS and BIOMEMS, examples. Introduction to generalised processes used.
  • Clean room: definition, classification, air flow system
  • Safety in handling hazardous materials in clean room
  • Scaling Laws in Miniaturization
  • Substrates and Wafers: CZ process and float zone process, Wafer types
  • Materials: Properties and applications of single crystal silicon, SiO2, Si3N4, SiC, Polysilicon, Glass
  • Wafer cleaning processes: RCA, Piranha
  • Positive and negative photoresist, mask, material properties of PMMA, SU8
  • Different projection systems,
  • Surface characterization techniques: AFM, SEM, TEM, Ellipsometer, Profilometer

Module 2: MEMS Fabrication Processes

  • Photolithography: Definition, steps, light sources (UV, DUV, EUV)
  • PVD: definition, types: Evaporation (Thermal and E-beam) and Sputtering (DC and RF), advantages, disadvantages, Material properties of Al
  • CVD: definition, reaction steps, types: APCVD, LPCVD, PECVD, and HWCVD, advantages, disadvantages
  • Oxidation: Thermal
  • Polymers coating techniques: spinning, spraying and electrodeposition
  • Doping: definition, types: Ion implantation and Diffusion, advantages, disadvantages
  • Etching: types: Dry etching (RIE, DRIE) and wet etching (isotropic and anisotropic), advantages, disadvantages, specific etchants

Module 3: Microfabrication Techniques

  • Bulk micromachining: definition, advantages and disadvantages, Examples: pressure sensor, dissolved wafer process
  • Surface micromachining: definition, advantages and disadvantages Examples: pressure sensor, cantilever
  • Non polysilicon surface micromachining: SOI fabrication
  • LIGA: definition, process steps, examples, advantages and disadvantages
  • X-ray lithography: Synchrotron radiation, X-ray mask
  • Molding techniques: Injection, compression, hot embossing
  • Soft lithography: Definition, SAMs, Types: Micro Contact Printing, Material properties of PDMS, Gold, Conducting polymers
  • Micro molding techniques: Replica molding, Microtransfer molding, Micromolding in capillaries and Solvent-assisted micromolding

Module 4: MICRO TOTAL ANALYSIS SYSTEMS (µTAS)

  • Flow techniques in µ-fluidics: pressure driven force, electro-osmosis, electrophoresis
  • Micropump, microvalves: types and fabrication
  • Microchannels: Types and fabrication (SU8, glass, silicon)
  • Separation techniques: capillary electropherosis, electrochromatography, isoelectric focusing
  • Detection techniques: fluorescence, chemiluminiscence

Module 5: MICRO/ NANO BIOSENSORS AND DRUG DELIVERY DEVICES

  • Biosensor: definition, block diagram
  • Classification based on the basis of detection techniques: electric, magnetic, optical, thermal, mechanical, and chemical
  • Basic steps involved in the development of biosensors: surface modification, immobilization, integration with transducer
  • Design, fabrication of cantilever for antibody detection
  • Hypodermic needles, transdermal patches: disadvantages
  • Micro needles: solid, hollow, polymer, silicon (fabrication)
  • Nano particles for drug delivery

Module 6: MICROSYSTEM PACKAGING

  • Packaging materials
  • Levels of packaging
  • Comparison between IC and MEMS packaging
  • Packaging technologies: Die preparation, surface bonding, wire bonding, sealing
  • Pressure sensor packaging

Text Books

  • 1 MEMS & MICROSYSTEMS Design and Manufacture, Tai-Ran Hsu, TATA McGraw Hill.
  • 2 Fundamentals of Microfabrication, Marc Madou, CRC Press.
  • 1 Fundamentals of BioMEMS and Medical Microdevices, Steven S. Saliterman, (SPIE Press Monograph Vol. PM153 by Wiley Interscience
  • 2 Microsystem Technology”, W. Menz, J. Mohr, 0. Paul, WILEY-VCH, ISBN 3. 527-29634-4
  • 3 Electro Mechanical System Design”, James J. Allen, Taylor & Francis Group, LLC, ISBN-0 8247 -5824-2, 2005
  • 4 MICROSYSTEM DESIGN, Stephen D. Senturia, KLUWER ACADEMIC PUBLISHERS, eBook ISBN: 0-306-47601-0 Theory Examination:

Reproduced from the University of Mumbai syllabus for B.E. (Biomedical Engineering) under REV-2019 'C' Scheme, in force from the academic year 2022-23. Wording is as printed in that syllabus. Module numbering is as printed there too.

The complete syllabus

This subject is cut from the University circular for its year. Open a document here if you want the whole thing rather than a single subject.

PDF 7.1 (R-A) B.E. (Biomedical Engineering) Sem I & II (Revised, NEP 2020) NEP 2020 syllabus Read full PDF Read
PDF 6.22 (N) B.E. (Biomedical Engineering) Sem III & IV (NEP 2020) NEP 2020 syllabus Read full PDF Read
PDF Item 139 B.E. (Biomedical Engineering) Second Year, Sem III & IV (REV-2019 'C' Scheme) REV-2019 'C' Scheme syllabus Read full PDF Read
PDF 6.1 B.E. (Biomedical Engineering) Third Year, Sem V & VI (REV-2019 'C' Scheme) REV-2019 'C' Scheme syllabus Read full PDF Read
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